Hard-Leader 2
AutoPhi IC Portfolio - Complete Functional Overview
IC Types & Categories
1. AI Accelerators & Coprocessors
- Performance Package Offload Coprocessor v1.0 - 32,000 TOPS peak performance
- PCIe x16 Full-Height Coprocessor v1.0 - 16,000 TOPS performance
- PCIe x8 Offload Coprocessor v1.0 - 16,000 TOPS performance
- Auto Coprocessor v2.0 - Advanced neural network processing
- Advanced AI Accelerator v2.0 - High-performance AI processing
2. GPU & Graphics Processing
- AutoPhi GPU v1.0 - High-performance graphics processing
- Display System v1.0 - Advanced display processing (HDMI, DisplayPort, VGA)
- Texture Processing Unit v1.0 - Specialized texture compression/decompression
3. CPU & Processing Units
- AutoPhi AFF CPU Core - Advanced out-of-order execution with multithreading
- Vector Processing Unit v1.0 - High-performance vector operations
- Matrix Accelerator v1.0 - Matrix operations and linear algebra
4. Interface & Communication
- PCIe Gen5/Gen6 Controllers - High-speed communication interfaces
- Memory Controllers - DDR4/DDR5 memory management
5. Power Management
- Advanced Power Management Unit - DVFS, power gating, thermal management
- Quantum-Classical Hybrid Power Management - Advanced quantum-enhanced optimization
Performance Tiers by Process Node
Variant | Process Node | Cores | Cache | Frequency | Target GFLOPS | Memory BW | AI Accelerators |
---|---|---|---|---|---|---|---|
Lite | 10nm | 64 | 32MB | 2.0GHz | 512 | 128 Gbps | 1 |
Economy | 7nm | 128 | 64MB | 2.5GHz | 1,280 | 256 Gbps | 2 |
Standard | 5nm | 256 | 128MB | 3.0GHz | 3,072 | 512 Gbps | 4 |
Pro | 5nm+ | 512 | 256MB | 3.5GHz | 7,168 | 768 Gbps | 6 |
Enterprise | 5nm++ | 1024 | 512MB | 4.0GHz | 16,384 | 1024 Gbps | 8 |
Ultra | 3nm | 2048 | 1GB | 4.5GHz | 36,864 | 1536 Gbps | 8 |
Quantum | 3nm+ | 4096 | 2GB | 5.0GHz | 81,920 | 2048 Gbps | 16 |
Extreme | 3nm++ | 8192 | 4GB | 5.5GHz | 180,224 | 3072 Gbps | 32 |
Key Functional Features
AI Acceleration Capabilities
- Neural Processing Units (NPU) - Dedicated AI acceleration hardware
- Tensor Cores - Matrix multiplication optimization
- Mixed Precision - FP16, FP32, INT8 support
- Convolution Engines - Optimized for deep learning workloads
- Framework Support - Universal, TensorFlow, PyTorch, ONNX compatibility
Memory System
- DDR5 Support - Latest memory standard with high bandwidth
- ECC Memory - Error-correcting code for reliability
- Multi-Channel - Up to 16 memory channels
- HBM Integration - High-bandwidth memory for AI workloads
Advanced Features
- Network-on-Chip (NoC) - Scalable interconnect architecture
- Hardware Security Modules - Dedicated security hardware with encryption
- Performance Monitoring - 16 performance counters for real-time metrics
- Thermal Management - Up to 64 temperature sensors with advanced throttling
- Chiplet Architecture - Modular design for dynamic expansion
Foundry Deliverables
Each IC variant includes complete foundry handoff packages with:
- RTL Design - Fully verified, synthesis-ready RTL
- Physical Design - Floorplan, placement, routing, timing closure
- GDSII Files - Manufacturing-ready layout files
- Timing Constraints - SDC files for timing closure
- Power Analysis - Comprehensive power reports
- Test Vectors - Manufacturing test patterns
- Documentation - Complete technical specifications
Business Model
AutoPhi sells IC foundry handoffs - complete, production-ready design packages delivered to semiconductor foundries for manufacturing, with values ranging from $100K to $5M per handoff package depending on complexity and performance tier.
This portfolio represents a comprehensive semiconductor design ecosystem covering the full spectrum from entry-level AI acceleration to extreme-scale quantum-classical hybrid systems.
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