AutoPhi SoC Stairpack




AutoPhi Ai-AFF IC – Summary

Project Owner: Chris G. Brown
Contact: info@cri-one.com
Sales: www.buyinvent.com
Year: 2025

Overview

The AutoPhi Ai-AFF IC is a highly scalable, advanced AI accelerator SoC family designed for next-generation artificial intelligence, machine learning, and high-performance computing workloads. The project supports a full spectrum of product variants, from entry-level to extreme-scale, leveraging advanced process nodes (10nm, 7nm, 5nm, 3nm) and foundry support (Samsung, TSMC, Intel).

Product Family

Variant Node Cores Cache Frequency
Lite 10nm 64 32MB 2.0GHz
Economy 7nm 128 64MB 2.5GHz
Standard 5nm 256 128MB 3.0GHz
Pro 5nm+ 512 256MB 3.5GHz
Enterprise 5nm++ 1024 512MB 4.0GHz
Ultra 3nm 2048 1GB 4.5GHz
Quantum 3nm+ 4096 2GB 5.0GHz
Extreme 3nm++ 8192 4GB 5.5GHz

Key Features

  • Highly Parameterized RTL: Supports easy scaling of core count, cache, memory, and I/O.
  • Advanced Memory System: Multi-channel DDR5/HBM, high bandwidth, ECC, and advanced power management.
  • PCIe Gen5/Gen6 Interface: High-speed host connectivity, x16 support, advanced error correction.
  • AI/ML Acceleration: Matrix/tensor engines, vector units, neural network ops, and custom compute units.
  • Power & Performance Management: DVFS, power gating, real-time monitoring, and adaptive control.
  • Comprehensive Verification: System-level and module-level testbenches, coverage, and performance tests.
  • Foundry-Ready: Documentation, constraints, DFT/scan/BIST stubs, and packaging for Samsung 3nm and other nodes.

Deliverables

  • Parameterized RTL (SystemVerilog)
  • Testbenches and verification environment
  • Synthesis and simulation scripts (Icarus Verilog, open-source flows)
  • Constraints (SDC/XDC)
  • Documentation (block diagrams, interface specs, datasheets, test plans)
  • Handoff checklist and packaging scripts
  • CI/CD integration for automated build/test

Documentation & Packaging

  • Each variant has its own config, documentation, and packaging.
  • All deliverables are organized for easy handoff to foundry or customer.
  • Packaging includes manifest, checksums, and all required files.

Status

  • All major blocks and testbenches are present.
  • Parameterization and automation are in place for scalable development.
  • Ready for foundry handoff and customer delivery.
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